AWARDS

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today.

 

ELSYS Design imagines and designs tomorrow’s electronic systems. It provides hardware and software expert design services, and supports international companies all along their embedded system developments. This includes the definition, the design and validation phases of partial or complete product.

 

ELSYS Eastern Europe, the branch of ELSYS Design based in Serbia, has recently been recognized by TI as winner of its 2017 Regional Supplier Recognition Award for Europe. As TI’s highest level of supplier recognition, the award highlights suppliers who have excelled in conducting business ethically while providing outstanding products, service and support that meet or exceed expectations for quality, environmental and social responsibility, technology, responsiveness, assurance of supply and cost. The winners of this award form an elite group selected from more than 10,000 suppliers.

 

“We are honored to receive this Supplier Excellence Award” comments Sasa Kostic, the ELSYS Eastern Europe Director. “It reflects the Texas Instruments satisfaction and confidence in the semiconductor design expertise we have been providing to them along the last years. We will go on striving for excellence with the same passion and dedication.”

GRADUATION THESIS LIST

#TopicDomain
1Clock domain crossing – issues and how to overcome themDD
2Scheduling techniques and their implementation for queue servicingDD
3Functional safety approaches implementation  in digital designDD
4Temperature sensor IP – Analysis, modeling and verificationAMS
5Bandgap reference IP – Analysis, modeling and verificationAMS
6Voltage regulator IP – Analysis, modeling and verificationAMS
7Internal oscillator IP – Analysis, modeling and verificationAMS
8Power-on Reset IP – Analysis, modeling and verificationAMS
9IP verification – MAC merge sublayer IP – MMSL – Link Layer Discovery Protocol control – LLDPDV
10IP verification – MAC merge sublayer IP – MMSL – MAC RxDV
11IP verification – MAC merge sublayer IP – MMSL – MAC TxDV
12SoC integration – 3PIAS ProjekatDD+DV
13SoC integration – ARM – Cortex M0 platform Integration using ARM SDKDD+DV
14SoC integration – ARM – Cortex M3 platform Integration using ARM SDKDD+DV
15SoC Verification – interdisciplinary themes – SW coverage collection and analysisDV
16SoC Verification – interdisciplinary themes – CPU instructions provided by SV TB instead of reading from Memory; (SV + ARM architecture)DV
17VIP Development – PCI ExpressDV
18VIP Development – DDRDV
19VIP Development – EthernetDV
20VIP Development – USBDV
21VIP Development – CSIDV
22VIP Development – DSIDV
23VIP Development – UNIPRODV
24VIP Development – I3CDV
25VIP Development – SLIMbusDV
26VIP Development – HDMIDV
Please note, although thesis are created in collaboration with professors, you need to get final approval by your UNI professor.