My Engineering Story: Miloš, Junior Design Engineer

With the experience gained, some things become easier, and I see ways to improve in the future, which is what fulfills me in this job

As a child, alongside a great interest in sports, I had a strong ambition for solving various logical and mathematical problems. This love was instilled in me by my father, who helped me solve various math problems from a young age and always left room for finding another, simpler solution. This lesson stayed with me as I grew older; whenever I had a problem to solve, I always tried to understand the problem and, by applying my previous experiences, thought about different ways to solve it.

After finishing high school, I enrolled at the Faculty of Technical Sciences in Novi Sad, majoring in Energy, Electronics, and Telecommunications. In my second year, I focused on the field of electronics and realized that digital electronics was my area of interest. The reason for this was solving real-world problems. Gaining some initial experience and confidence came through my final project in undergraduate studies, which directed my career toward the field of digital IC design.

I learned about the scholarship program through various company presentations at the faculty. I decided to apply for the position of digital IC designer. After successfully completing the internship, I got the job. Different projects have different requirements, and that is what makes this job challenging. With the experience gained, some things become easier, and I see ways to improve in the future, which is what fulfills me in this job.

If you’ve found Miloš’s story interesting, check out our Digital Design Internship Program , and find out more information on how to become  Digital Design Engineer at Elsys Eastern Europe.

 

WHERE PASSION LEADS TO EXCELLENCE

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GRADUATION THESIS LIST

#TopicDomain
1Clock domain crossing – issues and how to overcome themDD
2Scheduling techniques and their implementation for queue servicingDD
3Functional safety approaches implementation  in digital designDD
4Temperature sensor IP – Analysis, modeling and verificationAMS
5Bandgap reference IP – Analysis, modeling and verificationAMS
6Voltage regulator IP – Analysis, modeling and verificationAMS
7Internal oscillator IP – Analysis, modeling and verificationAMS
8Power-on Reset IP – Analysis, modeling and verificationAMS
9IP verification – MAC merge sublayer IP – MMSL – Link Layer Discovery Protocol control – LLDPDV
10IP verification – MAC merge sublayer IP – MMSL – MAC RxDV
11IP verification – MAC merge sublayer IP – MMSL – MAC TxDV
12SoC integration – 3PIAS ProjekatDD+DV
13SoC integration – ARM – Cortex M0 platform Integration using ARM SDKDD+DV
14SoC integration – ARM – Cortex M3 platform Integration using ARM SDKDD+DV
15SoC Verification – interdisciplinary themes – SW coverage collection and analysisDV
16SoC Verification – interdisciplinary themes – CPU instructions provided by SV TB instead of reading from Memory; (SV + ARM architecture)DV
17VIP Development – PCI ExpressDV
18VIP Development – DDRDV
19VIP Development – EthernetDV
20VIP Development – USBDV
21VIP Development – CSIDV
22VIP Development – DSIDV
23VIP Development – UNIPRODV
24VIP Development – I3CDV
25VIP Development – SLIMbusDV
26VIP Development – HDMIDV
Please note, although thesis are created in collaboration with professors, you need to get final approval by your UNI professor.