Elsys Eastern Europe | Open Day Application

Open Day Application

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#	Topic	Domain
1	Clock domain crossing – issues and how to overcome them	DD
2	Scheduling techniques and their implementation for queue servicing	DD
3	Functional safety approaches implementation in digital design	DD
4	Temperature sensor IP – Analysis, modeling and verification	AMS
5	Bandgap reference IP – Analysis, modeling and verification	AMS
6	Voltage regulator IP – Analysis, modeling and verification	AMS
7	Internal oscillator IP – Analysis, modeling and verification	AMS
8	Power-on Reset IP – Analysis, modeling and verification	AMS
9	IP verification – MAC merge sublayer IP – MMSL – Link Layer Discovery Protocol control – LLDP	DV
10	IP verification – MAC merge sublayer IP – MMSL – MAC Rx	DV
11	IP verification – MAC merge sublayer IP – MMSL – MAC Tx	DV
12	SoC integration – 3PIAS Projekat	DD+DV
13	SoC integration – ARM – Cortex M0 platform Integration using ARM SDK	DD+DV
14	SoC integration – ARM – Cortex M3 platform Integration using ARM SDK	DD+DV
15	SoC Verification – interdisciplinary themes – SW coverage collection and analysis	DV
16	SoC Verification – interdisciplinary themes – CPU instructions provided by SV TB instead of reading from Memory; (SV + ARM architecture)	DV
17	VIP Development – PCI Express	DV
18	VIP Development – DDR	DV
19	VIP Development – Ethernet	DV
20	VIP Development – USB	DV
21	VIP Development – CSI	DV
22	VIP Development – DSI	DV
23	VIP Development – UNIPRO	DV
24	VIP Development – I3C	DV
25	VIP Development – SLIMbus	DV
26	VIP Development – HDMI	DV

Open Day Application

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Please note, although thesis are created in collaboration with professors, you need to get final approval by your UNI professor.